Product Name: Beryllium oxide ceramic copper-clad substrate - Ceramic PCB - Beryllium oxide ceramic immersion gold

Material: Be0: 99.5%, Al203: 0.18%, Si02: 0.13%, others: 0.19%

Product model: YCB-TC-FT 2026050806

Thermal conductivity: 310W/m · K, dielectric constant: 6.9 (at 1MHz)

Thermal expansion coefficient: 9.2 × 10-6/° C

Density: 3.05g/cm3

Pressure free sintering temperature: 1750 ℃

Hardness:>HRA86 Compression strength:>350Mpa

Volume resistance:>1014

Dielectric breakdown strength: 25kV/mm Flatness:<0.035

Thickness: 0.85mm Metalization material: TiCuNiAu

Titanium layer thickness: 0.1 microns  Copper layer thickness: 300 microns

Nickel layer thickness: 5 microns  Gold layer thickness: 0.1 microns

Packaging size: 17.9 * 35.8 * 1.3cm

Weight: 20 grams

 Thermal conductivity:High thermal conductivity beryllium oxide ceramic substrate is used,with a thermal conductivity
far superior to conventional FR-4 board and alumina ceramic substrate. It can quickly dissipate the high heat
generated by power device operation, effectively suppress device temperature rise, and greatly improve the long-term
thermal stability of equipment operation.
High frequency transmission:The substrate has the core characteristics of low dielectric constant and low dielectric
loss, which can significantly reduce attenuation and distortion during the transmission of high-frequency signals
such as microwave and radio frequency, ensuring the integrity, accuracy, and consistency of high-frequency signal
transmission.
Insulation and voltage resistance:Beryllium oxide ceramic substrate has excellent high insulation and high breakdown
voltage performance, which can achieve stable electrical isolation under high voltage and high current conditions,
effectively avoiding short circuit and breakdown risks, and improving the safety and reliability of equipment
operation.
Weather resistance stability: the base material has excellent high temperature resistance, aging resistance and
corrosion resistance characteristics, and can work stably in a wide temperature range of -55 ℃~200 ℃, without the
risk of base material deformation and line falling off, and is suitable for use in extreme high and low temperatures
and harsh environments.
Thermal shock resistance: Beryllium oxide ceramic substrate has excellent thermal shock resistance and can withstand
severe temperature fluctuations without the risk of substrate cracking or line delamination. It is suitable for the
use of high-power pulse equipment with frequent start stop cycles.
High temperature resistance: The substrate is made of beryllium oxide ceramic material, which has a high temperature
resistance ability far exceeding that of conventional organic FR-4 and ordinary epoxy boards. It can be stable under
high temperature conditions of 200 ℃ for a long time and is suitable for long-term reliable use in high-power full
load operating equipment, high-temperature industrial environments, and extreme high temperature conditions in
aerospace.
Chemical stability: Beryllium oxide ceramic substrate has stable chemical properties and excellent acid and alkali
resistance, solvent resistance, and salt spray corrosion resistance. It can work stably for a long time in harsh
industrial environments such as humidity,salt spray,and chemical corrosion,without substrate degradation or circuit
oxidation problems.
Integrated adaptability: The board adopts a modular symmetrical circuit layout,which is compatible with high-density
integrated installation of multiple sets of power amplifier chips and matching circuit components, effectively
reducing the overall size of the equipment and greatly improving the integration and space utilization of the
electronic system.