product name: DBC Sappire ceramic,99.99% al2o3 ceramic substrate, ceramic PCB, TiWCu ceramic metallization 

material: Al203:99.99% | MgO:0.005% | TiO:0.003% | Other.0.002%
process: hydrothermal exchange method 
crystal orientation:C 
thermal conductivity:53 W/m.k 
dielectric constant:13.2TC 
thermal expansion coefficient:6.2*10-6/C 
density:4.15 g/cm3light transmittance:>65%
pressureless sintering temperature:1880 deg c 
hardness:>9 
compressure strength:>350 Mpa 
volume resistance:>1014
dielectric breakdown strength:25Kv/mm flatness:<5um 
thickness:0.11mm 
metallzation material: TiWCu 
Ti layer thickness:12um 
Wlayer thickness:13um 

Cu layer thickness:3.5um