Current carrying capacity: The thick copper layer design has high current carrying capacity, suitable for
high current working conditions of high-power power electronic equipment, effectively reducing line
conduction losses.
Thermal stability: The thermal expansion coefficient of the ceramic substrate is highly matched with that
of the silicon chip, which can significantly reduce the thermal stress caused by temperature changes and
avoid chip desoldering and substrate deformation failure.
Thermal conductivity: The heat conduction speed is extremely fast, which can quickly export the working
heat of the device,quickly reduce the working temperature,and avoid high temperature aging and overheating
failure.
Structural adaptability: Standardized pad layout and large-sized current carrying copper foil design can
directly adapt to multi chip parallel power module packaging, simplifying the device assembly process.
Insulation: Ceramic substrate has high insulation strength, high voltage breakdown resistance, and can
completely isolate live circuits from external metal structures, eliminating the risks of leakage, short
circuit, and ignition. It is safe and reliable to use.
Stability: resistant to high temperature, cold and hot shock, able to withstand extreme high and low
temperature cycles, long-term high temperature operation without cracking or deformation, material
performance does not deteriorate, and the working state is long-lasting and stable.
Craftsmanship: The copper foil surface has high flatness and excellent weldability, making it easy for
subsequent chip mounting, soldering, and other processing operations, reducing the difficulty and defect
rate of the production process.           
Adaptability: Stable chemical performance, acid and alkali resistance, corrosion resistance, salt spray
resistance, and moisture resistance. It can serve stably for a long time in harsh and complex environments
such as industry, military, aerospace, etc.
Mechanical properties: Ceramic substrates have high mechanical strength, excellent impact and vibration
resistance, and can stably adapt to harsh working conditions such as high vibration and high impact in
vehicles and industrial control.