Product name: 17.5 * 17.5 ceramic chip, gold-plated ceramic board, electrolytic ceramic multilayer board, ion implanted ceramic integrated circuit

Wafer material: Si02,> 99.99%
Packaging shell material: AlN,> 98%
Thickness of electroplating slurry: 0.00035mm
Number of photolithography mask layers: 15 layers
Electroplating type: UV
Built-in transistor specifications: 115nm
Built-in circuit process: etching + ion implantation
Ion implantation speed: 300000km/h
Total thickness: 2.3mm
Electrode: ceramic metallization + copper clad
Surface: polished
Ceramic firing temperature: 1680℃
Ceramic resonance coefficient: 270W/k.m
Flatness: <0.035mm
Ceramic volume resistivity:> 1013Q.Cm
Ceramic hardness:> 1150HV5