product name:Beryllia ceramic metallization，BeO ceramic immersion gold，ceramic PCB，TiPtAu ceramic metallization

material: BeO:99.5%    Al2O3: 0.18%    SiO2: 0.13%    Other: 0.19%

thermal conductivity：310 W/m.k    dielectric constant：6.9 at 1Mhz    

thermal expansion coefficient：9.2*10-6/℃         

density：3.05 g/cm3   

pressureless sintering temperature：1750 deg c      

hardness: >HRA86        compressure strength：>350 Mpa   

volume resistance：> 1014       

dielectric breakdown strength：25 Kv/mm     flatness：< 0.035           

thickness：1.25mm     metallization material：TiPtAu      

Ti layer thickness：0.3um   Pb layer thickness：0.5um           

Au layer thickness：0.1um

feature: scribed lines and driiled holes on single side