product name:AlN ceramic metallization，AlN ceramic immersion gold，ceramic PCB，TiCuNiAu ceramic metallization

material:Al : 63.51%     N : 33.52%       O : 1.91%     C: 0.66%

thermal conductivity：290 W/m.k    dielectric constant：9.1 at 1Mhz    

thermal expansion coefficient：4.6*10-6/℃          density：3.31 g/cm3    reduction temperature: 1750 deg c

pressureless sintering temperature：1950 deg c       hardness: >HRA86        compressure strength：>350 Mpa    volume resistance：> 1014         dielectric breakdown strength：25 Kv/mm     flatness：< 0.1mm           

thickness：1.25mm     metallization material：TiCuNiAu      

Ti layer thickness：0.1um   Cu layer thickness：300um           

Ni layer thickness: 5um     Au layer thickness：0.1um