High frequency characteristics:Adopting a planar thick film non inductive design,the parasitic inductance
is extremely low, and the signal distortion is small under high-frequency operation,perfectly adapting to
high-frequency circuit scenarios such as RF and microwave.
Heat dissipation performance:High purity alumina ceramic substrate has excellent thermal conductivity and
can quickly conduct working heat.The temperature rise control effect is outstanding when operating at full
power.
Power density:The flattened structure achieves small volume and high power output,greatly reducing circuit
installation space and adapting to high-density integrated ceramic substrates and PCB boards.
Electrical stability: Thick film resistor paste is firmly combined with ceramic substrate, with high
resistance accuracy,low temperature drift coefficient, nd extremely low resistance drift under long-term
working conditions.
Impact resistance performance: Ceramic substrates have high mechanical strength and can withstand
short-term pulse overload and surge voltage impact,making them less prone to faults such as open circuits
and sudden changes in resistance values.
Environmental adaptability:It supports stable operation in a wide temperature range,has excellent moisture
resistance, salt fog resistance, and anti-aging performance, and can adapt to harsh industrial, vehicle
and outdoor scenes.
Welding adaptability: Standardized surface mount electrode design, compatible with SMT automated mounting
process, strong compatibility with ceramic copper-clad substrates and ordinary PCB boards for welding.
Insulation performance: Aluminum oxide ceramic substrate has ultra-high electrical insulation strength,
can withstand high working voltage, and effectively avoid electrical safety risks such as leakage and
breakdown.