product name:DBC Sappire ceramic，99.99% al2o3 ceramic substrate，ceramic PCB，TiWCu ceramic metallization

material: Al2O3:99.99%    MgO: 0.005%    TiO: 0.003%    Other: 0.002%

process:hydrothermal exchange method

crystal orientation: C

thermal conductivity：53 W/m.k    dielectric constant：13.2 T C    

thermal expansion coefficient：6.2*10-6/℃         

density：4.15 g/cm3                light transmittance: >65%

pressureless sintering temperature：1880 deg c      

hardness: >9          compressure strength：>350 Mpa   

volume resistance：> 1014       

dielectric breakdown strength：25 Kv/mm     flatness：< 5um           

thickness：0.11mm     metallization material：TiWCu      

Ti layer thickness：12um          W layer thickness：13um           

Cu layer thickness：3.5um